Product Information
Circuit Materials
Anisotropic Conductive Paste
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SMERF™
SMERF is an anisotropic conductive paste (ACP) developed primarily for IC mounting on radio-frequency identification (RFID) inlays.
Its features include:
1. It is a one-component thermosetting epoxy adhesive with no volatile components and is easy to handle.
2. It provides good adhesion to various materials, including Al, Cu, Ag, polyethylene terephthalate (PET), and polyimide (PI).
3. It contains special conductive particles (Au/Ni-coated resin particles or gold-coated Ni particles) manufactured using proprietary technology, allowing selection to match the intended application.
4. By employing special conductive particles, high reliability is achieved even in high-temperature, high-humidity tests and thermal cycle tests.
5. SMERF exhibits no viscosity increase at room temperature (25°C) for 10 days.
6. SMERF recommends grades based on the ACP application method and IC electrode type.
We are happy to discuss the appropriate grade or specification changes.
Its features include:
1. It is a one-component thermosetting epoxy adhesive with no volatile components and is easy to handle.
2. It provides good adhesion to various materials, including Al, Cu, Ag, polyethylene terephthalate (PET), and polyimide (PI).
3. It contains special conductive particles (Au/Ni-coated resin particles or gold-coated Ni particles) manufactured using proprietary technology, allowing selection to match the intended application.
4. By employing special conductive particles, high reliability is achieved even in high-temperature, high-humidity tests and thermal cycle tests.
5. SMERF exhibits no viscosity increase at room temperature (25°C) for 10 days.
6. SMERF recommends grades based on the ACP application method and IC electrode type.
We are happy to discuss the appropriate grade or specification changes.
| Product Name | CAS RN® | Particle size | Core material | Metal coating | Viscosity | Pot life | Shelf life | Bonding conditions | Die shear strength | References |
|---|---|---|---|---|---|---|---|---|---|---|
| SMERF RL0609 | ー | 3μm | Resin | Ni/Au | 35 [Pas] | 10 days | 6 months | 170℃/8sec. | ≧10N |  |
| SMERF RL0507 | ー | 3μm | Resin | Ni/Au | 40 [Pas] | 10 days | 6 months | 170℃/8sec. | ≧10N | |
| SMERF NF0606 | ー | 5μm | Ni | Au | 40[Pas] | 3-4 days | 6 months | 190℃/2sec. | ≧10N | |
Main applications: One-component thermosetting epoxy adhesive for RFID inlay applications
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