Product Feature

SMERF is anisotropic conductive paste (ACP),
it is a product developed mainly for IC bonding for RFID inlay.
As for its features,
1. One component type thermosetting epoxy paste with no volatile components and easy to handle.
2. Adhesiveness of various materials such as Al, Cu, Ag, PET and PI is good.
3. Contains special conductive particles (Au / Ni coated resin particles or gold coated Ni particles) manufactured by proprietary technology and can be selected according to the application.
4. By adopting special conductive particles, high reliability can be obtained even in high temperature high humidity test and thermal cycle test.
5. SMERF has no viscosity rise at room temperature (25 ℃) for 10 days.
6. SMERF recommends grade according to ACP coating method and IC electrode type.
We will respond to consultation concerning appropriate grade or specification change.

Detailed Information

Regulatory Information

Contact Information

Specialty Products Sales Department

11-1, 9-CHOME, KAMEIDO, KOTO-KU, TOKYO. 136-8515 FIRST SALES GROUP, SPECIALTY PRODUCTS SALES DEPARTMENT, SALES DIVISION,　+81-3-3636-8295